To avoid becoming another victim of the ongoing chip crisis, we had to adapt and explore different ways of designing products. We tried a number of solutions, many of which we plan to continue to use even once this crisis is over. We would like to share these practices that have been helping us during this challenging time.
Embedded & Data Analytics CoE director Milan Piskla and HW engineer David Gustafik, Ciklum
9.40-10.15 Who Cares About AI ...And Should You?
Over the past few months the rise of large language models have brought AI to coffee table discussions all around the world. But what actually is AI? What are the new models capable of and how is AI being utilized in modern cyber security solutions to provide users what they deserve. The Best Security.
Cyber security expert Jarno Ahlström, Check Point Technologies
10.15-10.30 Mespek, EG Electronics, Richardsson RFPD
- Smarc standard the most popular modular industrial computing standard today
- OSM New standard for small footprint applications
Tiitus Aho, Technical lead, Avnet Embedded
11.30-12.30 LUNCH, EXHIBITION TIME
A snapshot of available and coming 4G and 5G modules and some new features in the latest and coming 3GPP releases. 4G and 5G cellular network deployments : Thoughts from a birds perspective.
Hans Andersson, Sales manager, AcalBFi
The R&S MXO 4 series is the first of a new generation of oscilloscopes that excels in both performance and value. The instruments deliver a once-in-a-decade engineering breakthrough for accelerated insight. They have the world’s fastest real-time update rate of 4.5 million waveforms/s, meaning engineers can see more infrequent events than with any other instrument.
Pasi Suhonen, Application Engineer for Oscilloscopes Nordic and Baltic regions, Rohde & Schwarz
Digital transformation demands for a huge increase of connectivity. Everything gets connected - even across different domains. How can international standards support to master this challenge?Where are we today and how may actual standardization efforts impact future designs and create new platforms? Basically I’m elaborating on a common customer question: What should I build into my next product?
Joachim Preissner, Field Application Engineer, Analog Devices
8.30 Embedded cyber security is a horizontal legal requirement in EU by end of 2024
Antti Tolvanen, Sales Director, Etteplan
9.15 Technology Trends with Embedded Computers
Timo Poikonen, key account manager, congatec
10.00 Post-quantum cryptography: The current status and future consequences
Kimmo Järvinen, CTO, Xiphera
TECHNICAL SESSION 1
11.00 Preparing for an uncertain regulatory future in IoT security
Sigurd Hellesvik, Application Engineer, Nordic Semiconductor
11.30 4G-5G & Wireless IoT devices - a Technical-Commercial peek
Hans Andersson, Sales manager, Acal BFi
12.00 Integration of safety related and non-safety related functionality on the same HW
Andrea J Beuter, Senior Sales Manager for EMEA at Real Time Systems GmbH
TECHNICAL SESSION 2
13.15 Modular Solutions for Rapid Roll-Out of EV Charging Infrastructure
Ronald Singh, Director distribution & OEM sales, Digi International
13.45 The challenge to adapt MIPI-DSI to a variety of TFT-display interfaces
Alexander Trica, Head of Touch and Embedded Development, Data-Modul
14.15 Mass-customization of products – a contradiction that makes sense
CEO Jon Linden, Ekkono Solutions AB
15.30 SPECIAL KEYNOTE
Cyberwarfare in Finland: The cyber security situation in Finland during the Ukrainian war and what kind of intelligence is needed.
Pertti Jalasvirta, Partner, CyberWatch Finland
ECF19 program looked like this
10.00 BREAK & EXHIBITION TIME
10.20 KEYNOTE 3 Etteplan Antti Tolvanen: IoT device cyber security is becoming regulated - are you ready?
Track 1: Digi International Ronald Singh: Build or Buy? Navigating the Decision on Whether to Outsource or Own-Design
Track 2: The Qt Company Tino Pyssysalo: Optimizing BOM in Embbedded Systems
Track 1: Data-Modul Wolfgang Meier: Data Modul Embedded Controller
Track 2: Altium Carsten Kindler: New Age of communication for Electronics Design & Development
12.30 LUNCH at the restaurant, EXHIBITION TIME
Track 1: Rutronik Julius Kaluzevicius: Rapid prototyping with RUT2CLOUD
Track 2: AcalBFi Hans Andersson: 10 years on the cellular network with only a small battery & the road to 5G
Track 1: congatec Timo Poikonen: Advantages of hardware consolidation for edge computing
15.00 SPECIAL KEYNOTE: Firstbeat Herman Bonner
All presentations from ECF18 can be downloaded as pdf versions below
AI comes - Is Finland Ready?
Heikki Ailisto, Research professor, VTT
How secure is my IoT?
Jaakko Ala-Paavola, CTO Etteplan
Closing the loop of an industrial value chain with MindSphere IoT
Ilmari Veijola, Head of Sales, Cloud Application Solutions, Siemens Oy
Secure the next-generation of IoT devices
David Källberg, FAE, IAR Systems
How to analyze IP connection security and battery consumption of your IoT device
- Increase the IP connection security of your IoT device
- IoT power consumption measurement (pdf on R&S website)
Markku Hintsala, Application Engineer, Rohde & Schwarz
How to create an secure AI solution in to your Edge?
Tim Jensen, Director of Software, Avnet Integrated
Fast algorithm prototyping with MATLAB for smart IoT systems
Antti Löytynoja, Senior AE, MathWorks
Costly mistakes IoT developers make and how to avoid them
Tino Pyssysalo, Senior Manager EMEA, The Qt Company
Open Source platform for IoT with cellular 2G to 4G
Hans Andersson & Luigi Tondo, Acal BFi Nordic
u-blox F9 - High precision GNSS for the mass market
Kim Kaisti, u-blox
Bridging the gap from rapid prototyping to market ready product
Juri Sipilä, CEO convergens
New Display Driving Solutions
Markus Mahl, Head of Product Marketing Embedded Solutions, Data Modul
Environmental Sensors for IoT
Anssi Saarinen, FAE Rutronik
IoT - making the connection
Tze Chiew, Product Sales Manager, Advantech
Intelligence at the edge - high performance embedded computing
Patrik Björklund, Tritech Solutions
Special keynote and demo:
Minima Processor: "Ultra-Low-Energy Solutions for IoT Devices"