SiTimen Titan-alustan MEMS-resonaattorit mullistavat 4 miljardin dollarin resonointikomponenttien markkinan. Ne ovat jopa seitsemän kertaa kvartsia pienempiä, mutta samalla kestävämpiä, energiatehokkaampia ja helpompia integroida. Älykelloista lääkinnällisiin implantteihin, IoT-laitteisiin ja Edge AI -sovelluksiin Titan avaa laitevalmistajille uusia mahdollisuuksia suunnitella aiempaa pienempiä, älykkäämpiä ja luotettavampia tuotteita.
"Disruption on the Edge of Cloud - Competetive Advantage Through Digital Value Chains" (lataa pdf klikkaamalla kuvaa)
Timo Seppälä, Research Associate at ETLA (The Research Institute of the Finnish Economy) "Ohjelmistot sulautettuna tuotteisiin vai tuotteet sulautettuna ohjelmistoihin?" (lataa pdf klikkaamalla kuvaa)
Tuukka Ahoniemi, Qt, Head of Strategy "From Devices to Platforms - Qt and the Evolution of Embedded Software" (lataa pdf klikkaamalla kuvaa)
11.00 am Panel discussion on the future of Embedded Technology in Finland
Kari Liuska, Etteplan, Senior Vice President, Embedded Systems and Industrial Internet Tuukka Sarkki, Vincit, Director Timo Seppälä, Research Associate at ETLA Tuukka Ahoniemi, Qt, Head of Strategy
12.00 pm lunch
1.00 pm Technical tracks: Tools and HW, Platforms and SW Click on the titles to see the pdf presentations.
Etteplan supports customers cross industries in digitalizing their business from requirement specifications to solution development and implementation. With over 30 years of experience, Etteplan has the needed expertise to develop a wide range of industrial applications, from large established companies to start-ups. We deliver complete turn-key solutions containing cross-discipline know-how.
CN Rood offers technical solutions in the field of testing and measurement. We aim to remain leaders in that regard. Our customers are often not looking for a product, but for a solution, and we all have the drive to work on that solution. What we love to do most is to continually work on the latest developments in the field of testing and measuring equipment. Now and in the future.
EBV Elektronik was founded in 1969 and is one of the leading specialists in European semiconductor distribution. This success is based on the underlying company philosophy, which was developed a long time ago and which still applies today: operational excellence, flexibility, reliability and execution – with the goal of achieving the highest degree of customer satisfaction.
Tria is a world leader in the design and manufacture of embedded computing for OEMs. We offer a broad range of off-the-shelf modules to fully customized systems built for our customers. With a global footprint and deep in-house expertise, we support innovators from design to delivery.
congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals.
Mespek was founded in 1989. Our main products are embedded electronic modules, industrial PCs with peripherals, KVM and server management products, as well as wireless solutions for IoT applications.
Since 1985, Digi International Inc. (Digi) has been a pioneer in wireless communication, forging the future for connected devices and responding to the needs of the people and enterprises that use them.
CVG Convergens is an ICT services company specialized in embedded systems, smart connected products and ICT systems and processes for SME businesses. Our mission is to help our clients, our team, and the society to improve and thrive by providing reliable and sustainable solutions, services, and products by creative and efficient application of technology.
BCC Solutions Oy is a Finnish company that, in addition to expert services, offers comprehensive equipment solutions for data transfer and telecommunication networks, as well as their analysis, testing and measurement. We broadly represent the industry's leading brands.
Acal BFi has trusted expertise in advanced electronics for 50 years. If you’re in search of a trusted technology solutions partner, your search ends here. Our extensive knowledge, cutting-edge portfolio, and worldwide capabilities are at your service to bring the future into reality.
ECF25 will be organised on September 16, 2025 at Maria 01 startup campus in the center of Helsinki. The event will be free of charge for qualified visitors.
There are two different sponsoring packages: GOLD and SILVER.
♦ GOLD SPONSOR 3000 euros Great visibility on the dedicated ECF site. A presentation slot in the technical programme. A table top booth with all the benefits of an exhibitor.
♦ SILVER SPONSOR 1500 euros Table top booth.
To book your place in this 7th annual ECF contact either ETN editor-in-chief Veijo Ojanperä or the sales manager Rainer Raitasuo. The space is limited, so please act now.
As before, the attending the event is free for visitors. The registration for the event will be opened in March.
Veijo Ojanperä Tämä sähköpostiosoite on suojattu spamboteilta. Tarvitset JavaScript-tuen nähdäksesi sen. +358-407072530
Rainer Raitasuo Tämä sähköpostiosoite on suojattu spamboteilta. Tarvitset JavaScript-tuen nähdäksesi sen. +46-734171099
As Edge AI continues to gain momentum in the Embedded industry, it is essential to address its security implications. Many Edge AI applications operate in safety-critical environments and critical infrastructure, where security cannot be overlooked. This presentation explores key threats, relevant regulations, and practical implementation strategies for building Secure Edge AI solutions.
Jaakko Ala-Paavola, technology director, Etteplan
10.45 KEYNOTE: Solving the Top 5 Challenges of Bringing your Embedded System to Life
High-complexity, low-volume embedded systems—whether in medical devices, industrial machinery, or energy applications—face a unique set of hurdles on the path from concept to market. In this session, we’ll break down the five most common challenges that threaten schedules and budgets: rapid prototyping, thorough validation and software testing, design for manufacturing, navigating market forces, and managing skilled personnel. You’ll learn how NI’s CompactRIO platform together with CN Rood's market expertise helps teams address these issues head-on—accelerating development, improving quality, and delivering rugged, reliable systems faster. Real-world success stories will illustrate how engineers have used CompactRIO to cut time-to-market without sacrificing performance or flexibility.
Aku WIlenius, Country Sales Manager, Finland, CN Rood
11.30 Buy vs chip down design - What are the possible benefits & downsides
Tiitus Aho, Global Technical Lead, Tria Technologies / EBV
LUNCH
13.30 Digi ConnectCore embedded modules and the related ConnectCore Cloud and Security Services
Presentation: Cybersecurity Regulations: A Paradigm Shift Meeting the EU Cyber Resilience Act with insights from Digi International — ensuring a clear path to compliance! Joe Hill, FAE Digi International
14.15 How to Simplify the Use of Embedded Technology
Cybersecurity, edge deployment, and new AI capabilities are adding fresh layers of complexity to embedded system development. At the same time, cost pressures, shorter time-to-market, and growing demands for connectivity and reliability are raising the stakes. This presentation will illustrate how modular hardware and software building blocks – combined with comprehensive embedded vendor services – enable designers to create scalable, future-proof solutions. By reducing development costs and supporting agile design, these approaches help developers address today’s challenges while preparing for future requirements and business models yet to emerge. Timo Poikonen, Senior Business Development Manager EMEA, congatec
15.00 Panel discussion: Partnership Models in Electronics Distribution: Manufacturers, Distributors, and the Role of AI
This panel explores how electronics manufacturers and distributors collaborate, how responsibilities are divided, and what different partnership models exist. We will also discuss how the rise of artificial intelligence may reshape these relationships and create new ways of working together.
15.45 Award Announcement At the end of the event, a product prize will be awarded — sponsored by OnePlus.
The All-New InfiniiVIsion HD3 series from Keysight. HD3 series is a 14-bit analog-to-digital converter (ADC) oscilloscope that delivers four times the signal resolution and half the noise of other general-purpose oscilloscopes. Sales manager Petri Sutela
11.00 CVG Convergens
Custom vs off-the-shelf - perspectives for 2025 Choosing custom embedded hardware over Commercial Off-The-Shelf (COTS) hardware depends on several factors. What should you consider in 2024/25 before making the decision? Tomi Engdahl, Senior Software Engineer
12.00 Lunch
13.00 Adlink Technology
OSM - a shortcut for full custom single board computers Adlink will be presenting the latest open standard for Computer On Modules (COM) called Open Standard Module (OSM). The presentation will be focusing on the advantages the new OSM standard has compared with full custom single board computers and existing COM standards like Q7 and SMARC. Henrik Petersen, Key Account Manager, Adlink Technology
To avoid becoming another victim of the ongoing chip crisis, we had to adapt and explore different ways of designing products. We tried a number of solutions, many of which we plan to continue to use even once this crisis is over. We would like to share these practices that have been helping us during this challenging time.
Embedded & Data Analytics CoE director Milan Piskla and HW engineer David Gustafik, Ciklum
Over the past few months the rise of large language models have brought AI to coffee table discussions all around the world. But what actually is AI? What are the new models capable of and how is AI being utilized in modern cyber security solutions to provide users what they deserve. The Best Security.
Cyber security expert Jarno Ahlström, Check Point Technologies
A snapshot of available and coming 4G and 5G modules and some new features in the latest and coming 3GPP releases. 4G and 5G cellular network deployments : Thoughts from a birds perspective.
The R&S MXO 4 series is the first of a new generation of oscilloscopes that excels in both performance and value. The instruments deliver a once-in-a-decade engineering breakthrough for accelerated insight. They have the world’s fastest real-time update rate of 4.5 million waveforms/s, meaning engineers can see more infrequent events than with any other instrument.
Pasi Suhonen, Application Engineer for Oscilloscopes Nordic and Baltic regions, Rohde & Schwarz
Digital transformation demands for a huge increase of connectivity. Everything gets connected - even across different domains. How can international standards support to master this challenge?Where are we today and how may actual standardization efforts impact future designs and create new platforms? Basically I’m elaborating on a common customer question: What should I build into my next product?
Joachim Preissner, Field Application Engineer, Analog Devices
ECF22
KEYNOTE SESSION
8.30 Embedded cyber security is a horizontal legal requirement in EU by end of 2024 Antti Tolvanen, Sales Director, Etteplan
9.15 Technology Trends with Embedded Computers Timo Poikonen, key account manager, congatec
Track 1: Rutronik Julius Kaluzevicius: Rapid prototyping with RUT2CLOUD Track 2: AcalBFi Hans Andersson: 10 years on the cellular network with only a small battery & the road to 5G
Kun suurteholaskennan (HPC) työkuormat monimutkaistuvat, generatiivinen tekoäly sulautuu yhä tiiviimmin moderneihin järjestelmiin ja lisää kehittyneiden muistiratkaisujen tarvetta. Vastatakseen näihin muuttuviin vaatimuksiin ala kehittää uuden sukupolven muistiarkkitehtuureja, jotka maksimoivat kaistanleveyden, minimoivat latenssin ja parantavat energiatehokkuutta.
Commodore 64 Ultimate on ehkä täydellisin nostalgialevyke, jonka 2020-luvun retrobuumi on meille toistaiseksi tarjonnut. Se näyttää Commodorelta, kuulostaa Commodorelta ja toimii Commodorena – koska se pitkälti on Commodore. Uusi laite perustuu AMD Xilinx Artix-7 -FPGA:han, joka jäljentää alkuperäisen emolevyn logiikan piiritasolla. Mutta mitä enemmän speksejä selaa, sitä selvemmin nousee esiin yksi kysymys: miksi kukaan tarvitsee tätä?
Kun suurteholaskennan (HPC) työkuormat monimutkaistuvat, generatiivinen tekoäly sulautuu yhä tiiviimmin moderneihin järjestelmiin ja lisää kehittyneiden muistiratkaisujen tarvetta. Vastatakseen näihin muuttuviin vaatimuksiin ala kehittää uuden sukupolven muistiarkkitehtuureja, jotka maksimoivat kaistanleveyden, minimoivat latenssin ja parantavat energiatehokkuutta.
