9.00 doors open
10.00 KEYNOTE: Secure Edge AI
As Edge AI continues to gain momentum in the Embedded industry, it is essential to address its security implications. Many Edge AI applications operate in safety-critical environments and critical infrastructure, where security cannot be overlooked. This presentation explores key threats, relevant regulations, and practical implementation strategies for building Secure Edge AI solutions.
Jaakko Ala-Paavola, technology director, Etteplan
10.45 KEYNOTE: Solving the Top 5 Challenges of Bringing your Embedded System to Life
High-complexity, low-volume embedded systems—whether in medical devices, industrial machinery, or energy applications—face a unique set of hurdles on the path from concept to market. In this session, we’ll break down the five most common challenges that threaten schedules and budgets: rapid prototyping, thorough validation and software testing, design for manufacturing, navigating market forces, and managing skilled personnel. You’ll learn how NI’s CompactRIO platform together with CN Rood's market expertise helps teams address these issues head-on—accelerating development, improving quality, and delivering rugged, reliable systems faster. Real-world success stories will illustrate how engineers have used CompactRIO to cut time-to-market without sacrificing performance or flexibility.
Aku WIlenius, Country Sales Manager, Finland, CN Rood
11.30 Buy vs chip down design - What are the possible benefits & downsides
Tiitus Aho, Global Technical Lead, Tria Technologies / EBV
LUNCH
13.30 Digi ConnectCore embedded modules and the related ConnectCore Cloud and Security Services
Presentation: Cybersecurity Regulations: A Paradigm Shift
Meeting the EU Cyber Resilience Act with insights from Digi International — ensuring a clear path to compliance!
Joe Hill, FAE Digi International
14.15 How to Simplify the Use of Embedded Technology
Cybersecurity, edge deployment, and new AI capabilities are adding fresh layers of complexity to embedded system development. At the same time, cost pressures, shorter time-to-market, and growing demands for connectivity and reliability are raising the stakes. This presentation will illustrate how modular hardware and software building blocks – combined with comprehensive embedded vendor services – enable designers to create scalable, future-proof solutions. By reducing development costs and supporting agile design, these approaches help developers address today’s challenges while preparing for future requirements and business models yet to emerge.
Timo Poikonen, Senior Business Development Manager EMEA, congatec
15.00 Panel discussion: Partnership Models in Electronics Distribution: Manufacturers, Distributors, and the Role of AI
This panel explores how electronics manufacturers and distributors collaborate, how responsibilities are divided, and what different partnership models exist. We will also discuss how the rise of artificial intelligence may reshape these relationships and create new ways of working together.
15.45 Award Announcement
At the end of the event, a product prize will be awarded — sponsored by OnePlus.
PREVIOUS EVENTS
ECF24
9.30 congatec
aReady - your cyber secure building block
Timo Poikonen, Senior Key Account Manager Nordics
10.15 Testhouse Nordic
The All-New InfiniiVIsion HD3 series from Keysight. HD3 series is a 14-bit analog-to-digital converter (ADC) oscilloscope that delivers four times the signal resolution and half the noise of other general-purpose oscilloscopes.
Sales manager Petri Sutela
11.00 CVG Convergens
Custom vs off-the-shelf - perspectives for 2025
Choosing custom embedded hardware over Commercial Off-The-Shelf (COTS) hardware depends on several factors. What should you consider in 2024/25 before making the decision?
Tomi Engdahl, Senior Software Engineer
12.00 Lunch
13.00 Adlink Technology
OSM - a shortcut for full custom single board computers
Adlink will be presenting the latest open standard for Computer On Modules (COM) called Open Standard Module (OSM). The presentation will be focusing on the advantages the new OSM standard has compared with full custom single board computers and existing COM standards like Q7 and SMARC.
Henrik Petersen, Key Account Manager, Adlink Technology
14.00 LUMI - Europes fastest supercomputer
LUMI is the fastest super computer in Europe - Dan Still, CSC
How LLM models are trained in LUMI - Aleksi Kallio, CSC
15.00 Etteplan - NIS2, RED, CRA, AI Act and Data Act
New regulations affecting embedded devices
Antti Tolvanen, Sales Director, Etteplan
ECF23
KEYNOTE SESSION
9.00-9.35 Adapting to Change: Lessons from the Chip Crisis for Electronic Circuit Design
To avoid becoming another victim of the ongoing chip crisis, we had to adapt and explore different ways of designing products. We tried a number of solutions, many of which we plan to continue to use even once this crisis is over. We would like to share these practices that have been helping us during this challenging time.
Embedded & Data Analytics CoE director Milan Piskla and HW engineer David Gustafik, Ciklum
9.40-10.15 Who Cares About AI ...And Should You?
Over the past few months the rise of large language models have brought AI to coffee table discussions all around the world. But what actually is AI? What are the new models capable of and how is AI being utilized in modern cyber security solutions to provide users what they deserve. The Best Security.
Cyber security expert Jarno Ahlström, Check Point Technologies
EXHIBITOR BRIEFINGS
10.15-10.30 Mespek, EG Electronics, Richardsson RFPD
TECHNICAL SESSION
11.00-11.30 Chip down vs modular approach in embedded computing
- Smarc standard the most popular modular industrial computing standard today
- OSM New standard for small footprint applications
Tiitus Aho, Technical lead, Avnet Embedded
12.30-13.00 4G-5G Mobile Broadband & IoT – 3GPP, user equipment hardware and systems
A snapshot of available and coming 4G and 5G modules and some new features in the latest and coming 3GPP releases. 4G and 5G cellular network deployments : Thoughts from a birds perspective.
Hans Andersson, Sales manager, AcalBFi
13.30-14.00 MXO 4 - The Next generation oscilloscope for accelerated insight
The R&S MXO 4 series is the first of a new generation of oscilloscopes that excels in both performance and value. The instruments deliver a once-in-a-decade engineering breakthrough for accelerated insight. They have the world’s fastest real-time update rate of 4.5 million waveforms/s, meaning engineers can see more infrequent events than with any other instrument.
Pasi Suhonen, Application Engineer for Oscilloscopes Nordic and Baltic regions, Rohde & Schwarz
14.30-15.00 Future developments in ethernet connectivity towards real-time and long distance
Digital transformation demands for a huge increase of connectivity. Everything gets connected - even across different domains. How can international standards support to master this challenge?Where are we today and how may actual standardization efforts impact future designs and create new platforms? Basically I’m elaborating on a common customer question: What should I build into my next product?
Joachim Preissner, Field Application Engineer, Analog Devices
ECF22
KEYNOTE SESSION
8.30 Embedded cyber security is a horizontal legal requirement in EU by end of 2024
Antti Tolvanen, Sales Director, Etteplan
9.15 Technology Trends with Embedded Computers
Timo Poikonen, key account manager, congatec
10.00 Post-quantum cryptography: The current status and future consequences
Kimmo Järvinen, CTO, Xiphera
TECHNICAL SESSION 1
11.00 Preparing for an uncertain regulatory future in IoT security
Sigurd Hellesvik, Application Engineer, Nordic Semiconductor
11.30 4G-5G & Wireless IoT devices - a Technical-Commercial peek
Hans Andersson, Sales manager, Acal BFi
12.00 Integration of safety related and non-safety related functionality on the same HW
Andrea J Beuter, Senior Sales Manager for EMEA at Real Time Systems GmbH
TECHNICAL SESSION 2
13.15 Modular Solutions for Rapid Roll-Out of EV Charging Infrastructure
Ronald Singh, Director distribution & OEM sales, Digi International
13.45 The challenge to adapt MIPI-DSI to a variety of TFT-display interfaces
Alexander Trica, Head of Touch and Embedded Development, Data-Modul
14.15 Mass-customization of products – a contradiction that makes sense
CEO Jon Linden, Ekkono Solutions AB
15.30 SPECIAL KEYNOTE
Cyberwarfare in Finland: The cyber security situation in Finland during the Ukrainian war and what kind of intelligence is needed.
Pertti Jalasvirta, Partner, CyberWatch Finland
ECF19
8.00 BREAKFAST
KEYNOTES
8.30 KEYNOTE 1 Arm Zach Shelby, VP of Developers: TinyML - The 3rd Wave of Embedded Compute
9.15 KEYNOTE 2 Advantech Bobby Vale: Data Delivery: The Key to Digital Transformation
10.00 BREAK & EXHIBITION TIME
10.20 KEYNOTE 3 Etteplan Antti Tolvanen: IoT device cyber security is becoming regulated - are you ready?
11.00 BREAK
TECHNICAL PRESENTATIONS
11.30-12.00
Track 1: Digi International Ronald Singh: Build or Buy? Navigating the Decision on Whether to Outsource or Own-Design
Track 2: The Qt Company Tino Pyssysalo: Optimizing BOM in Embbedded Systems
12.00-12.30
Track 1: Data-Modul Wolfgang Meier: Data Modul Embedded Controller
Track 2: Altium Carsten Kindler: New Age of communication for Electronics Design & Development
13.30-14.00
Track 1: Rutronik Julius Kaluzevicius: Rapid prototyping with RUT2CLOUD
Track 2: AcalBFi Hans Andersson: 10 years on the cellular network with only a small battery & the road to 5G
14.00-14.30
Track 1: congatec Timo Poikonen: Advantages of hardware consolidation for edge computing
15.00 SPECIAL KEYNOTE: Firstbeat Herman Bonner
ECF18
All presentations from ECF18 can be downloaded as pdf versions below
KEYNOTES
AI comes - Is Finland Ready?
Heikki Ailisto, Research professor, VTT
How secure is my IoT?
Jaakko Ala-Paavola, CTO Etteplan
Closing the loop of an industrial value chain with MindSphere IoT
Ilmari Veijola, Head of Sales, Cloud Application Solutions, Siemens Oy
TECHNICAL PRESENTATIONS
Secure the next-generation of IoT devices
David Källberg, FAE, IAR Systems
How to analyze IP connection security and battery consumption of your IoT device
Presentations:
- Increase the IP connection security of your IoT device
- IoT power consumption measurement (pdf on R&S website)
Markku Hintsala, Application Engineer, Rohde & Schwarz
How to create an secure AI solution in to your Edge?
Tim Jensen, Director of Software, Avnet Integrated
Fast algorithm prototyping with MATLAB for smart IoT systems
Antti Löytynoja, Senior AE, MathWorks
Costly mistakes IoT developers make and how to avoid them
Tino Pyssysalo, Senior Manager EMEA, The Qt Company
Open Source platform for IoT with cellular 2G to 4G
Hans Andersson & Luigi Tondo, Acal BFi Nordic
u-blox F9 - High precision GNSS for the mass market
Kim Kaisti, u-blox
Bridging the gap from rapid prototyping to market ready product
Juri Sipilä, CEO convergens
New Display Driving Solutions
Markus Mahl, Head of Product Marketing Embedded Solutions, Data Modul
Environmental Sensors for IoT
Anssi Saarinen, FAE Rutronik
IoT - making the connection
Tze Chiew, Product Sales Manager, Advantech
Intelligence at the edge - high performance embedded computing
Patrik Björklund, Tritech Solutions
Special keynote and demo:
Minima Processor: "Ultra-Low-Energy Solutions for IoT Devices"
