Sulauteutun tekniikan ECF25 järjestetään ensi viikon tiistaina. Ohjelma on valmis, mutta nyt on viimeinen hetki ilmoittautua mukaan.
Rekisteröityminen onnistuu täällä. Paikka on viimevuotiseen tapaan Maria01-kampus ja Event Space -tila siellä.
Lisätietoja löytyy ECF-sivustolta osoitteesta https://etn.fi/index.php/embedded-conference-finland/
Nähdään ECF25:ssa tiistaina!
ECF25-ohjelma
9.00 doors open
10.00 KEYNOTE: Secure Edge AI
As Edge AI continues to gain momentum in the Embedded industry, it is essential to address its security implications. Many Edge AI applications operate in safety-critical environments and critical infrastructure, where security cannot be overlooked. This presentation explores key threats, relevant regulations, and practical implementation strategies for building Secure Edge AI solutions.
Jaakko Ala-Paavola, technology director, Etteplan
10.45 KEYNOTE: Solving the Top 5 Challenges of Bringing your Embedded System to Life
High-complexity, low-volume embedded systems—whether in medical devices, industrial machinery, or energy applications—face a unique set of hurdles on the path from concept to market. In this session, we’ll break down the five most common challenges that threaten schedules and budgets: rapid prototyping, thorough validation and software testing, design for manufacturing, navigating market forces, and managing skilled personnel. You’ll learn how NI’s CompactRIO platform together with CN Rood's market expertise helps teams address these issues head-on—accelerating development, improving quality, and delivering rugged, reliable systems faster. Real-world success stories will illustrate how engineers have used CompactRIO to cut time-to-market without sacrificing performance or flexibility.
Aku Wilenius, Country Sales Manager, Finland, CN Rood
11.30 Buy vs chip down design - What are the possible benefits & downsides
Tiitus Aho, Sales Director, Tria Technologies
LUNCH
13.30 Digi ConnectCore embedded modules and the related ConnectCore Cloud and Security Services
Presentation: Cybersecurity Regulations: A Paradigm Shift
Meeting the EU Cyber Resilience Act with insights from Digi International — ensuring a clear path to compliance!
Joe Hill, FAE Digi International
14.15 How to Simplify the Use of Embedded Technology
Cybersecurity, edge deployment, and new AI capabilities are adding fresh layers of complexity to embedded system development. At the same time, cost pressures, shorter time-to-market, and growing demands for connectivity and reliability are raising the stakes. This presentation will illustrate how modular hardware and software building blocks – combined with comprehensive embedded vendor services – enable designers to create scalable, future-proof solutions. By reducing development costs and supporting agile design, these approaches help developers address today’s challenges while preparing for future requirements and business models yet to emerge.
Timo Poikonen, Senior Business Development Manager EMEA, congatec
15.00 Panel discussion: Partnership Models in Electronics Distribution: Manufacturers, Distributors, and the Role of AI
This panel explores how electronics manufacturers and distributors collaborate, how responsibilities are divided, and what different partnership models exist. We will also discuss how the rise of artificial intelligence may reshape these relationships and create new ways of working together.
15.45 Award Announcement
At the end of the event, a product prize will be awarded — sponsored by OnePlus.
Kun suurteholaskennan (HPC) työkuormat monimutkaistuvat, generatiivinen tekoäly sulautuu yhä tiiviimmin moderneihin järjestelmiin ja lisää kehittyneiden muistiratkaisujen tarvetta. Vastatakseen näihin muuttuviin vaatimuksiin ala kehittää uuden sukupolven muistiarkkitehtuureja, jotka maksimoivat kaistanleveyden, minimoivat latenssin ja parantavat energiatehokkuutta.
